App.:Bluetooth headset
Thickness:0.8mm
Surface treatment:ENIG
Material:FR4/PI TG 150
Layer:4L Rigid Flex(1+2+1)
App.:Smart Phones
Thickness:1.0mm
Surface treatment:ENIG+OSP
Material:FR4 TG150
Layer:8L HDI(2+4+2)
App.:Digital Electronics
Thickness:0.8mm
Surface treatment:ENIG+OSP
Material:FR4 TG150
Layer:8L HDI(2+4+2)
App.:Digital Electronics
Thickness:0.9mm
Surface treatment:ENIG+OSP
Material:FR4 IT-170GRAI
Layer:10L ELIC(4+2+4)